G7868Q X6 Server

G7868Q X6 server supports a new 8-GPU module (SXM5 and OAM 2.0), with a modular design that significantly enhances maintainability. The GPU module and CPU feature a cold-plate liquid cooling design, achieving energy efficiency and high-density deployment. The main control unit supports up to two Intel® Xeon® 4th or 5th Generation Scalable Processors, combined with 8-channel 5600MT/s DDR5 memory technology, delivering users a bandwidth increase of up to 50%. With support for 16 PCIe 5.0 slots and up to 27 drive bays, it meets the requirements of various computing architecture solutions, further boosting system performance. It is suitable for large-scale training, high-performance computing (HPC), large data centers, and other high-computing-power scenarios.

  • Compatible with a variety of computing modules
    Release superior computing performance

    Compatible with HGX H800 8-GPU module or standard OAM2.0 module, fully meet the needs of large computing power scenarios;

  • Flexible topology design
    Suitable for different application scenarios

    Flexible switching of GPU topology to meet the requirements of various computing power scenarios; The PCIe card module can adjust resource allocation based on service requirements to fully release computing power performance.

  • Modular design
    Overall increase in maintainability

    Modular system design, the main control unit, computing unit, heat dissipation unit and PCIe card unit can support independent maintenance, to achieve easy operation and maintenance; Support liquid cooling modules to meet the heat dissipation requirements in multiple scenarios;

Application scenario

  • Large Module Application
    Module training
    Learning easoning

  • High Performance Computing
    Data analysis
    Scientific research

  • Data Processing
    Speech recognition
    Image processing

  • Data Center
    Virtualization
    Private cloud
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Technical specification
Name Specifications
GPU module GPU-GPU module (compatible with NV module and universal OAM2.0 module)
Processor Supports up to 2 Intel® Xeon® 4th or 5th Generation Scalable Processors or Montage Jintide® Processor Series, with a maximum of 64 cores per CPU and a maximum power of 385W.
Memory Supports up to 32 DDR5 memory slots at rates up to 5600MT/s, supports RDIMMs or LRDIMMs, and has a capacity of up to 8TB;
Support CXL 1.1, support HBM technology
Storage controller Integrated 6Gb/s SATA controller; Optional 12Gb/s SAS HBA and 12Gb/s SAS RAID controller
Hard disk expansion System SAS/SATA/NVMe drive configuration:
Supports up to 27 x 2.5-inch drives, including up to 10 NVMe drives. Also supports 2 x 2280/22110 SATA or 1 x 2280/22110 NVMe M.2 SSD.
PCIe expansion Supports up to 16 PCIe 5.0 expansion slots.
Supports up to 16 x16 PCIe 5.0 standard slots (8 from CPU, 8 from Switch).
Supports up to 6 x16 PCIe 5.0 FH standard slots.
Supports 1 OCP3.0 onboard slot.
Management Software Integrated BMC management chip AST2600, supporting IPMI2.0, Redfish, SOL, KVM, virtual media, and other functions.
Network Supports 1 OCP3.0 NIC, with optional 1/10/25/50/100/200/400GE PCIe standard NICs.
Security Supports chassis intrusion detection; supports Intel PFR3.0 and SGX2.0 security technologies; supports TCM/TPM security modules.
Fan Supports 10 sets of high-performance fans (2 fans per set), with N+1 hot-swappable redundancy.
Power supply Support six 3500W 54V platinum power supplies (4200W/5200W in the future), optional expansion of two 2000W/2400W/2700W/3200W
12V platinum power supplies, optional titanium power supply *, support N+N redundancy /N+1 redundancy
Operating temperature 5 ° C ~ 40 ° C (The operating temperature can be affected by different configurations)
Appearance/Chassis size 8U chassis
352mm (H) × 447mm (W) × 917mm (depth)