The core integrated circuits supporting modern wireless/wired data transmission are responsible for signal modulation/demodulation, encoding/decoding, and protocol processing. They integrate RF transceivers, baseband processing, and high-performance computing units, supporting communication standards such as 5G NR, Wi-Fi 6, Bluetooth, and LoRa to achieve low-latency, high-bandwidth data interaction. Typical applications include smartphones, IoT terminals, satellite navigation, and industrial automation equipment. Through multi-band aggregation technology and AI-assisted signal optimization, they can adapt to complex electromagnetic environments with power consumption as low as milliwatt levels. The chips feature built-in encryption engines and anti-interference algorithms to ensure secure and reliable communication. Current 7nm/5nm advanced processes significantly improve integration while remaining compatible with open architectures like Open RAN, accelerating the evolution of 6G, vehicle networking, and edge computing technologies.
- Mixed-Signal Chips
Analog-to-Digital/Digital-to-Analog Converter Chips (ADC/DAC)
Function
ADC: Converts analog signals (e.g., voltage, current) to digital signals.
DAC: Restores digital
signals to analog signals.
Representative Products
ADC: TI ADS1256 (24-bit high precision), ADI AD7799
DAC: ADI AD5686, Maxim MAX5320
Features
High resolution (12-24 bit), low noise, strong anti-interference capability.
Applications
Industrial sensors (temperature, pressure data acquisition)
Audio equipment (microphone signal
digitization, speaker signal generation)
Audio equipment (microphone signal digitization,
speaker signal generation)
Integrated Microcontrollers (MCU)
Function
Built-in analog peripherals (e.g., ADC, DAC, comparators) + digital processing core (ARM Cortex-M series).
Representative Products
STM32 series (with ADC and DAC), TI MSP430 (low power)
Features
Single-chip solution for signal acquisition, processing, and control, reducing external components.
Applications
Smart home (temperature/humidity sensor data processing)
Motor control (speed regulation via
PWM output)
Battery management (voltage monitoring and charge/discharge control)
Sensor Interface Chips
Function
Integrated analog front-end (signal amplification, filtering) + digital interface (SPI/I2C).
Representative Products
TI PGA460 (ultrasonic sensor interface), Analog Devices AD7793 (strain gauge interface)
Features
High sensitivity, electromagnetic interference (EMI) resistance, programmable gain.
Applications
Automotive electronics (tire pressure monitoring, acceleration sensors)
Industrial IoT
(vibration/displacement sensor data transmission)
Wearable devices (heart rate monitoring
modules)
Digital Signal Processors (DSP) + Analog Front-End
Function
High-performance digital signal processing (e.g., FFT, filtering) + analog signal conditioning.
Representative Products
TI TMS320F28379D (specialized for motor control), ADI ADSP-21489
Features
High processing speed (GHz level), supports complex algorithms.
Applications
Frequency converters (motor control algorithms)
Communication base stations (signal
modulation/demodulation)
Audio equipment (real-time noise reduction processing)
Power Management Mixed-Signal Chips
Function
Analog power conversion (DC-DC, LDO) + digital control (e.g., PWM generation, fault protection).
Representative Products
TI UCD9248 (digital power manager), Maxim MAX16984
Features
High efficiency, programmability, dynamic voltage regulation.
Applications
Servers (multi-phase power management)
Electric vehicles (battery pack balancing control)
Drones (motor drive power optimization)
