Core integrated circuits that support modern wireless/wired data transmission, responsible for signal modulation/demodulation, encoding/decoding, and protocol processing. They integrate RF transceivers, baseband processing, and high-performance computing units, supporting communication standards such as 5G NR, Wi-Fi 6, Bluetooth, and LoRa, enabling low-latency, high-bandwidth data interaction. Typical applications include smartphones, IoT devices, satellite navigation, and industrial automation equipment. Through multi-band aggregation technology and AI-assisted signal optimization, they adapt to complex electromagnetic environments with power consumption as low as milliwatt levels. The chips feature built-in encryption engines and anti-interference algorithms to ensure secure and reliable communication. Current 7nm/5nm advanced processes significantly improve integration while remaining compatible with open architectures like Open RAN, accelerating the evolution of 6G, vehicle networking, and edge computing technologies.
- Communication Chips
Baseband Chips
Function
Process digital signals, responsible for encoding, decoding, and protocol stack management.
Representative Products
Qualcomm Snapdragon, Huawei Kirin.
Features
Support multi-mode communication (2G/3G/4G/5G), with speeds up to 10Gbps (5G baseband).
Integrated AI engines (e.g., Hexagon processor in Snapdragon 8 Gen 1).
Applications
Smartphones, base stations, IoT devices (e.g., 5G CPE).
RF Chips
Function
Transmit and receive wireless signals, processing high-frequency signals.
Representative Products
Skyworks SKY77855 (5G PA), Qorvo QM5650 (Wi-Fi 6 RF).
Features
Frequency coverage from Sub-6GHz to millimeter wave (24-100GHz).
High-power amplifier (PA)
efficiency of 40%~60%.
Applications
Mobile phone antenna modules, Wi-Fi routers, Bluetooth headphones.
Modem Chips
Function
Perform signal modulation (digital→analog) and demodulation (analog→digital).
Representative Products
Huawei Balong 5000 (5G), MediaTek MT6769 (LTE).
Features
Support LTE Cat.20 (downlink 2Gbps), 5G NSA/SA dual-mode.
Low power consumption (e.g., Balong
5000 consumes < 5W in eMBB scenarios).
Applications
Data cards, smart wearables, vehicle networking (V2X).
Optical Communication Chips
Function
Convert electrical signals to optical signals (transmit) or optical signals to electrical signals (receive).
Representative Products
Finisar FTLF1318P (10Gbps optical module), Hisilicon optical chips.
Features
Speed range from 10Gbps to 800Gbps (e.g., 800G PAM4 modulation).
Wavelength
850nm (short-range), 1310nm/1550nm (long-range).
Applications
Fiber-optic communication, data center switches, 5G fronthaul/backhaul.
Wireless Connectivity Chips
Function
Enable short-range wireless communication (e.g., Wi-Fi, Bluetooth, Zigbee).
Representative Products
Broadcom BCM43684 (Wi-Fi 6E), Nordic nRF52840 (Bluetooth 5.3).
Features
Wi-Fi 6E supports 160MHz bandwidth, high-speed data transfer.
Satellite Communication Chips
Function
Enable wide-area communication via satellite links.
Representative Products
Iridium satellite communication modules, Huawei Mate 60 Pro satellite communication chip.
Features
Support L-band (1.6GHz), Ku-band (12-18GHz).
Strong anti-interference capability, covering
oceans and remote areas.
Applications
Maritime communication, aviation emergencies, outdoor adventure equipment.